Re: The Transam Triton Personal Computer
It looks like the chips go face down on the ceramic substrate. Maybe an early version of a bga. Is there an insulating layer on the circuit side of the chip with round holes in the insulating layer for solder balls?
You might check if the remains on the ceramic will melt with a soldering iron or hot air pencil, just to check if it was an adhesive instead.
Then a small amount of paste on each chip pad. Reflow with hot air pencil to form a ball. Line up on the pads and reflow with hot air pencil after applying plenty of flux.
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