Quote:
Originally Posted by Mark1960
when sucking the solder from the holes work from the solder side of the board. This might just reduce the cumulative effect of heat on the adhesive holding the pads to the board...
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Good point - For practical purposes you have to apply heat to the top pads when lifting the pins out, so it might be better to switch to the underside pads when it comes to clearing the holes.
As Mark said, the chief danger with boards this old is that if you heat a pad for too long you will burn it right off the board (the adhesive which attaches the pad to the PCB will give up and the pad will just float free off the PCB).