Quote:
Originally Posted by ortek_service
If those chips under the clear adhesive / glob-top were silicon die, that was wire-bonded to the pads rather than soldered (Even zooming into image, it's not detailed enough to tell), then the die is usually glued down underneath it. So that adhesive (or solder if soldered) must have failed as well.
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Back to those Hall sensor modules I put some high res photos here
Hall sensor chip close up
Hall Sensor module
Hall sensor front side close up
They are very small, the two large rectangles in the chip close up photo must be the sensor itself.